Wireless Comm. Letters - Journal Paper
- G. Gradoni and M. Di Renzo
- "End-to-end mutual coupling aware communication model for reconfigurable intelligent surfaces: An electromagnetic-compliant approach based on mutual impedances,"
- IEEE Wireless Communications Letters, vol. 10, no. 5, pp. 938-942, May 2021
- https://arxiv.org/abs/2009.02694